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Journalpaper

Transient Liquid Phase (TLP) Bonding of TiAl/Ti6242 with Ti-Cu foil

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  • URL: https://publications.hereon.de/id/21978/
  • Authors:Duan, H., Kocak, M., Bohm, K.-H., Ventzke, V.
  • Year:2004
  • In: Science and Technology of Welding and Joining
  • Volume:9
  • Issue:6
  • Pages:525 - 531
  • Type:Journalpaper
  • ISSN: 1362-1718
  • Cite as: Duan, H.; Kocak, M.; Bohm, K.-H.; Ventzke, V.: Transient Liquid Phase (TLP) Bonding of TiAl/Ti6242 with Ti-Cu foil. In: Science and Technology of Welding and Joining. Vol. 9 (2004) 6, 525 - 531. (DOI: 10.1179/136217104225021869)
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